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Introducing new DOWSIL™ TC-5550 Thermally Conductive Compound - created for the high-performance materials challenges in next-generation electronics technology. This innovative silicone grease can be used in place of a PCM or thermal pad, and was designed for bare die and lidless CPUs, providing high pump-out resistance and high-throughput.
Aircooling • Basics • Cooling • Reviews • Thermal grease and pads • Watercooling Industrial paste vs. AliExpress and mainstream: DOWSIL TC-5550, Gelid GC-4 and Snowman MTGS in a thermal paste review of large tubes
DOWSILTM TC-5550 Thermally Conductive Compound is designed to provide efficient thermal transfer for the cooling of electronic modules, and good pump-out resistance especially in bare die application
DOWSIL™ TC-5550 Thermally Conductive Compound, is a one-part silicone compound with high thermal conductivity (5.0 W/mk), low thermal resistance (0.04 °C-cm2/W), low BLT (0.02 mm), specially designed for bare die applications due to its good pump-out resistance.
DOWSIL™ TC-5550 Thermally Conductive Compound is grease like material that is highly loaded with thermally conductive fillers in a silicone matrix. This combination promotes high thermal conductivity, low pump-out and high-temperature stability. The compound is designed to maintain a positive heat sink seal to improve heat transfer from an electrical device or PCB system assembly to a heat ...
Dow Dowsil TC-5550 Thermally Conductive Compound is a 1-Part , Solvent free formulation, Silicone, Liquid used to Thermal interface material . View datash
Above-average performing paste, successor to the DOWSIL TC-5888, suitable for GPU and CPU and very reliable
DOWSIL™ TC-5550 Thermal Conductive Compound. Thermally Conductive Material for Electronic Protection. Get in Touch for Quote & Technical Support.
DOWSIL TC-5550 is a printable grease for bare-die and lidless microprocessor packages that avoids pump-out and delivers performance stability. It is designed for high performance processors that need better heat dissipation and meets the 2023 BIG INNOVATION Award criteria.
Dow Corning DOWSIL TC-5550 Halnziye HY-P17 Parker THERM-A-GAP GEL 60HF Shin-Etsu MicroSi G7762 Savio Glacier TG-04 Maxtor CTG10 AAirhut GX-14 Kooling Monster KOLD-01 (2024, NEW_EU) ID Cooling Frost X45 Alseye T12 Dow Corning DOWSIL TC-5888