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TIM2: In the TIM2 level between the heat-spreader and the heat-sink we also recommend our compressible interface material - Heat-Springs ® or liquid metal Thermal Interface Materials Although many TIM1 soldering processes use indium-containing materials to obtain the lowest thermal resistance for IC cooling, our engineers and industry partners ...
(TIM2) is material that is between the heat sink and the lid. (TIM1) is a material that is between the IC and the lid. Do note that TIM1.5 is an alternative design where the material sits directly on the bare die and interfaces to the heat sink. This design has no lid present. It is
Heat presents a significant challenge for electronics packaging and can, in part, limit further miniaturization. Thermal interface material (TIM) improves heat transfer between two surfaces to manage that limitation.
A thermal interface material (shortened to TIM) is any material that is inserted between two components in order to enhance the thermal coupling between them [1].A common use is heat dissipation, in which the TIM is inserted between a heat-producing device (e.g. an integrated circuit) and a heat-dissipating device (e.g. a heat sink).
TIM2 θ heat sink Thermal impedances TIM1 Integrated Heat Spreader Tc (Case Temp ≈ 60-70°C) Tj (Junction Temp ≈90-100°C) Silicon BGA Substrate TIM2 Heat Sink Ta (Ambient Temp ≈38-40°C) TIM1.5 Silicon BGA Substrate Heat Spreader
Learn about the functions, types, and performance criteria of metal TIMs, such as solder, liquid, and phase change metals, for heat transfer in electronics. See examples of TIMs for IC packages, heat sinks, and other applications.
Learn how DuPont's silicone based TIM1 and TIM2 materials dissipate heat from electronic components and improve reliability. TIM1 and TIM2 are two categories of thermal interface materials that work together at the chip and package level.
TIM1, TIM1.5, TIM2. Indium Corporation continues to lead the way in developing cutting-edge thermal interface materials (TIMs) and processes, including applications for TIM1, TIM1.5, and TIM2. TIM1: Solder preforms are used as a solder thermal interface material between a processor die and a heat-spreader at the TIM1 level.
This very effective conduction mechanism is a property of liquid as well as solid metals and alloys. In addition to the high thermal conductivity of all metals, those in the liquid form will also exhibit low interfacial resistance ensuring that they can dissipate heat quickly. Liquid metals are used in both TIM1 an d TIM2 applications. Keywords
This paper presents a case study on how to choose and qualify a suitable thermal interface material (TIM2) for CPU cooling applications. It compares the thermal conductivity, interface resistance, viscosity, conformity and reliability of different TIM2 materials, including phase change and grease-based ones.